The ARAMIS systems are non-contact and material-independent measuring systems based on digital image correlation (DIC). They provide information on the properties of the used materials and the behavior of the resulting parts under load. The results form the basis for product durability, geometrical layout and reliable numerical simulations and validations.
The high-resolution ARAMIS SRX sensor comprises the latest camera technology including 12-megapixels cameras and can be used for various applications. In high-speed materials and components testing, up to 2000 images per second can be captured. Thus, the failure behavior of parts can be captured locally and over time in high resolution. A special HD mode was developed for crash applications. In this mode, high-speed sequences can be analyzed in high resolution with an image recording rate of 1000 Hz. The combination of high resolution and high speed allows precise results for applications that require both capturing an event in detail over time and capturing local effects.
The ARAMIS SRX is complemented by the GOM Touch Probe, a tactile measuring system expansion, which is optically tracked by the ARAMIS system. The GOM Touch Probe allows tactile measurements of coordinates at areas that are difficult to access optically. Tactile measurement is also useful to align the part.
Moreover, the ARAMIS SRX shows a high stability and process reliability and is very user-friendly, which is why it is primarily used in industrial environments. The specimens can be measured independently from their geometry and temperature with accuracies up to the micrometer range. Time-consuming and expensive part preparation is not necessary anymore. For statically or dynamically loaded specimens and parts, ARAMIS SRX provides precise 3D data, such as coordinates, displacements, velocities and accelerations, surface strains and material characteristics. These data serve as input parameters for numerical simulations (stress-strain curve, etc.) and evaluations of 6 degrees of freedom (6DoF).
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