Clariant’s sugar-based glucamide allows solid, waterless personal care formulations

With a sulfate-free, low-water content, 100% biodegradable formula, and a reduced carbon footprint, GlucoTain® GEM embodies conscious beauty, according to Clariant

Prinova to showcase capability for private label sports nutrition at PLMA

Prinova will debut at the PLMA World of Private Label International Trade Show (28-29 May in Amsterdam) by highlighting its newly expanded contract manufacturing capabilities for sports nutrition.

Crafting tomorrow's AI landscape

Intel is painting a future AI accelerator competitive landscape with three viable options: itself, AMD and, of course, Nvidia.

dsm-firmenich to unveil biotic vitamin Humiome® B2 at Vitafoods 2024

Humiome® B2 is the first ‘biotic’ vitamin powered by patented Microbiome Targeted Technology™

Schenck Process FPM will transition its name under Coperion

Effective 1 August 2024, Schenck Process will officially transition its name and brand under Coperion

AST breaks ground in Singapore for high-end substrates & advanced tech

AST recently broke ground for the construction of a FC-BGA substrate factory on Pesawat Drive near Jurong Lake District.

Infineon strengthens position in automotive semiconductor market

Infineon's overall market share increased by one percentage point, from nearly 13% in 2022 to about 14% in 2023, solidifying its position as the global leader in the automotive semiconductor market.

Charting the Path: Taiwan's 2024 breakthrough in AI integration

The New Paradigm of Enterprise AI: Comprehensive Expansion and Twin Transformation for an Intelligent Green Future

China gears up 2024 ADAS market

China will be the main driver regionally considering the size and advanced state of its domestic PV market.

UMC offers 3D IC solution for RFSOI

Available on UMC's 55nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of RF performance.

Lower integration efforts for large-surface laser micromachining setups

New partnerships provide product developers and manufacturers easy pathways to test and implement XL SCAN worldwide

Ansys, TSMC to enable multiphysics platform for optics and photonics

Ansys is collaborating with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE).